Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and

Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ReleaseDate 2025-05-19
UnitCount 1
EANs 9789819641659

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration