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Integrated Circuit Packaging, Assembly and Interconnections (Springer Series in Advanced Microelectronics)

Product ID: 0387281533 Condition: USED (All books in used condition)

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Condition - Very Good

The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.

Integrated Circuit Packaging, Assembly and Interconnections (Springer Series in Advanced Microelectronics)

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.