Microwave and Millimeter-Wave Electronic Packaging
Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.
Technical Specifications
Shipping & Delivery
Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.
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