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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Product ID: 120857423
Condition: USED (All books in used condition)
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Condition: USED (All books in used condition)
Product Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Technical Specifications
Country
USA
Brand
McGraw-Hill Education
Manufacturer
McGraw-Hill Professional
Binding
Hardcover
EANs
9780070366480







