3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Product Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Technical Specifications
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