Ball Grid Array Technology
Product ID: 007036608X
Condition: USED (All books in used condition)
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Product Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
Ball Grid Array Technology
A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains b&w photos and diagrams. Annotation copyright Book News, Inc. Portland, Or.
Technical Specifications
Country
USA
Manufacturer
McGraw-Hill Professional
Binding
Hardcover
UnitCount
1
EANs
9780070366084
