Description
Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.
Microelectronics Failure Analysis Desk Reference (Book + CD set)
This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: Failure Analysis Process Flow, Failure Verification, Failure Modes and Failure Classification, Special Devices (MEMS, Optoelectronics, Passives, Fault Localization Techniques: Package Level (NDT), Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods, Deprocessing & Imaging Techniques: Deprocessing, General Imaging Techniques, Local Deprocessing & Imaging, Circuit Edit and Design Modification, Material Analysis Techniques, Reference Information: Important Topics for Semiconductor Devices, Failure Analysis Techniques Roadmap, Failure Analysis Operations and Management, Appendices: Failure Analysis Terms, Definitions, and Acronyms, Industry Standards
