Area Array Packaging Processes: for BGA, Flip Chip, and CSP
Product Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
Area Array Packaging Processes: for BGA, Flip Chip, and CSP
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Technical Specifications
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