Books > Self Service > Custom Stores > 5edb3046-f9c1-4621-85f5-a4f7c2464a28_0 > 5edb3046-f9c1-4621-85f5-a4f7c2464a28_8401 > By Publisher > McGraw-Hill > McGraw-Hill Engineering Store > Electrical Engineering > Circuits
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Product ID: 0071351418
Condition: USED (All books in used condition)
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R 1,097
includes Duties & VAT
Delivery: 10-20 working days
Ships from USA warehouse.
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Product Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Technical Specifications
Country
USA
Height
8.8
Length
6.1
Weight
2.40083403318
Width
1.8
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