Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)

Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)

Product ID: 0070377154 Condition: USED (All books in used condition)

Payflex: Pay in 4 interest-free payments of R290.50. Read the FAQ
R 1,162
includes Duties & VAT
Delivery: 10-20 working days
Ships from USA warehouse.
Secure Transaction
VISA Mastercard payflex ozow
Buy in USA

Product Description

Condition - Very Good

The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.

Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)

The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested, and manufactured. This new, still evolving technology for packaging printed circuit boards (PCBs) is commanding intense interest and excitement. Now one of its pioneers has written the first book that not only describes MCM technology, but also shows designers how to use it in practice. This groundbreaking, hands-on guide covers such practical issues as electronics testing, rework procedures, and failure modes and mechanisms.

Technical Specifications

Country
USA
Height
9.5
Length
6.5
Weight
1.4991433816
Width
1